Probe card and semiconductor wafer inspection method using the same

ABSTRACT

A probe card has a thin film substrate having projection electrodes on a first surface facing the semiconductor wafer and at a position facing the pad electrodes, a non-contact electrode, and first electrodes provided a second surface opposite to the first surface; and a wiring substrate having second electrodes disposed at a side opposite to the semiconductor wafer in the thin film substrate and at a position facing the first electrodes. The wiring substrate and the thin film substrate form a first sealed space and the thin film substrate and the semiconductor wafer form a second sealed space. By reducing the pressure in the first and the second sealed space, the first and the second electrodes are brought into close contact with each other and the pad electrodes and the projection electrodes are brought into close contact with each other, and the pressure of each of the first and second sealed space can be independently adjusted.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Japanese Patent Application No.2009-219857 filed on Sep. 25, 2009, the disclosure of which includingthe specification, the drawings, and the claims is hereby incorporatedby reference in its entirety.

BACKGROUND

The present invention relates to a probe card that collectively inspectsa plurality of semiconductor chips in a wafer level and a semiconductorwafer inspection method using the same, and particularly relates to aprobe card that performs inspection by transmitting and receivingsignals by non-contact coupling, such as inductive coupling orcapacitive coupling, and a semiconductor wafer inspection method usingthe same.

During manufacturing of a semiconductor integrated circuit, a pluralityof semiconductor integrated devices (chips) are simultaneously formedthrough a diffusion process on a semiconductor wafer. However, in themanufacturing process, all the plurality of chips simultaneouslymanufactured are usually difficult to be made non-defective articles dueto various factors, such as dust. Therefore, the manufactured chips needto be individually inspected whether or not the chips are non-defective.The inspection has roughly two sorting processes: inspection forremoving defects by actually operating devices and burn in sorting ofconfirming whether or not the devices have a problem with thereliability also after used in a market for a given period of time.

In order to mount a plurality of chips in one package or to manufacturea device having an increased packaging density by stacking chips in athree dimension manner to connect mutual chips, which is a techniquethat has been attracting attention in recent years, it is necessary toconfirm that each chip is non-defective beforehand. Otherwise, thenon-defective ratio of products obtained by integrating a plurality ofchips decreases when a larger number of chips are integrated because thetotal non-defective ratio is determined by the product of thenon-defective ratio of each chip.

Therefore, before each chip is mounted, the chips need to be inspectedand sorted in a wafer level. As a method therefor, by using a probe cardthat performs wafer collective contact disclosed in Japanese PatentPublication No. 7-231019 (hereinafter referred to as Document 1) andaccording to the method disclosed in Japanese Patent Publication No.8-005666 (hereinafter referred to as Document 2), the probe card isbrought into contact with a semiconductor wafer to perform inspectionand burn in. The structure of a probe card employing a thin filmsubstrate with a bump that follows changes in the inspection temperatureto control the coefficient of thermal expansion to be equal to that of awafer in the process is also disclosed in Document 1.

In order to obtain electrical connection for each pad electrode ofchips, the number of contactable terminals is limited in terms of weightlimitation even when the method of Document 2 is used. Therefore, amethod for transmitting and receiving signals in a non-contact stateusing capacitive coupling or inductive coupling that is not limited inthe total weight is disclosed in Japanese Patent Publication No.2009-85720, International Publication No. WO2006/069309 pamphlet, Y.Yoshida, K. Nose, Y. Nakagawa, K. Noguchi, Y. Morita, M. Tago, T.Kuroda, and M. Mizuno, “Wireless DC Voltage Transmission UsingInductive-Coupling Channel for Highly-Parallel Wafer-Level Testing,”IEEE International Solid-State Circuits Conference (ISSCC'09), Dig.Tech. Papers, pp. 470-472, February 2009, and S. Kawai, H. Ishikuro, andT. Kuroda, “A 4.7 Gb/s Inductive Coupling Interposer with Dual ModeModem,” IEEE Symposium on VLSI Circuits, Dig. Tech. Papers, pp. 92-93,June 2009, and the like.

SUMMARY

However, when capacitive coupling is used, in the above-describedstructure such that signals are transmitted and received in anon-contact state, the signal strength is attenuated in inverseproportion to the distance of a connection pad. When inductive couplingis used, there are problems in that the signal strength is notablyattenuated, signals from adjacent electrodes cause interference and thelike when spaced apart by a distance approximately equal to or largerthan the diameter of an inductor.

Accordingly, when communicating using a noncontact probe card or thelike, a non-contact probe needs to be brought close to an inspectiontarget chip as much as possible.

In view of the above-described problems, it is an object of the presentinvention to achieve, when transmitting and receiving signals bycapacitive coupling or inductive coupling in a non-contact state to/froma semiconductor wafer, stable transmission and reception of signals byincreasing the electromagnetic coupling.

In order to achieve the above-described object, the present inventiongives a probe card with a structure such that a first sealed space isformed, the pressure of which is reduced to be lower than theatmospheric pressure, by a wiring substrate and a thin film substratehaving a bump electrode or the like, and a second sealed space, thepressure of which is reduced to be lower than the atmospheric pressure,by a thin film substrate and an inspection target semiconductor wafer,in which the pressure of the first sealed space is made higher than thepressure of the second sealed space.

Specifically, the probe card according to the present invention isdirected to a probe card that is formed on a semiconductor wafer andcollectively inspects a plurality of semiconductor chips each having aplurality of pad electrodes, and the probe card has: a thin filmsubstrate having a plurality of projection electrodes on a first surfacefacing the semiconductor wafer and at a position facing each of the padelectrodes, a non-contact electrode to be electrically connected to thepad electrodes by capacitive coupling or inductive coupling, and aplurality of first electrodes provided on a second surface opposite tothe first surface and electrically connected to each of the projectionelectrodes and the non-contact electrode; and a wiring substrate havinga plurality of second electrodes disposed at a side opposite to thesemiconductor wafer in the thin film substrate and at a position facingthe first electrodes, in which the wiring substrate and the thin filmsubstrate form a first sealed space and the thin film substrate and thesemiconductor wafer form a second sealed space; the first electrodes andthe second electrodes are brought into close contact with each other andthe pad electrodes and the projection electrodes are brought into closecontact with each other by reducing the pressure in the first sealedspace and the second sealed space; and the pressure of each of the firstsealed space and second sealed space can be independently adjusted.

According to the probe card of the invention, by reducing the pressureof the first sealed space and the second sealed space, the firstelectrodes and the second electrodes are brought into close contact witheach other and the pad electrodes and the projection electrodes arebrought close contact with each other, and the pressure of each of thefirst sealed space and the second sealed space can be independentlyadjusted. Thus, by adjusting the pressure of the first sealed space tobe higher than the pressure of the second sealed space, the thin filmsubstrate contacting both the first sealed space and the second sealedspace expands toward the semiconductor wafer. As a result, thenon-contact electrode provided on the thin film substrate is broughtcloser to the pad electrodes formed on the semiconductor chip, and thusthe electromagnetic coupling in a non-contact state increases andsignals can be stably transmitted and received.

In the probe card of the invention, the pressure of the first sealedspace is preferably adjusted to be higher than that of the second sealedspace.

The probe card of the invention may further have an anisotropicallyconductive sheet that is provided between the wiring substrate and thethin film substrate and contains an elastic material conducting in amutually pressing direction between the first electrode and the secondelectrode.

In the structure, even when the height of each pad electrode formed onthe semiconductor wafer is not uniform, the pad electrodes and theprojection electrode can be surely contacted.

The probe card of the invention may further have: a firstanisotropically conductive sheet that is provided between the wiringsubstrate and the thin film substrate and contains an elastic materialconducting in a mutually pressing direction of the wiring substrate andthe thin film substrate; a pitch conversion substrate that is providedbetween the wiring substrate and the first anisotropically conductivesheet and has electrodes facing the first electrodes on the side facingthe thin film substrate and electrodes facing the second electrodes onthe side facing the wiring substrate; and a second anisotropicallyconductive sheet that is provided between the wiring substrate and thepitch conversion substrate and contains an elastic material conductingin a mutually pressing direction of the wiring substrate and the pitchconversion substrate.

In the structure, even when the types of the inspection targetsemiconductor wafers vary, the pitch conversion substrate, the secondanisotropically conductive sheet, and the thin film substrate may bematched to new types, and the versatility of the probe card(particularly wiring substrate) of the invention can be increased.

In the probe card of the invention, the non-contact electrode is formedon the first surface of the thin film substrate; and the thin filmsubstrate has, on the second surface, a thin film back surface electrodeto be electrically connected to the non-contact electrode, in which thethin film back surface electrode may be formed at a position apart fromthe non-contact electrode by a distance at least 10 times the filmthickness of the thin film substrate.

In the structure, a region in the circumference of the non-contactelectrode in the thin film substrate can sufficiently extend, and thusthe distance from the semiconductor wafer of the non-contact electrodecan be surely made small.

In this case, the area of the thin film back surface electrode may besmaller than the area of the first electrodes connected to theprojection electrodes.

In the structure, the contact pressure with the semiconductor wafer ofthe non-contact electrode can be suppressed, and thus the contactpressure of the projection electrodes formed on the thin film substrateand the pad electrodes formed on the semiconductor chip can beincreased.

In the probe card of the invention, the non-contact electrode may beformed on the first surface or the second surface of the thin filmsubstrate and at a position apart from the nearest first electrode ofthe plurality of the first electrodes by a distance at least 10 timesthe film thickness of the thin film substrate and the thin filmsubstrate has, on the second surface, a thin film back surface electrodeto be directly connected to the non-contact electrode.

Also in the structure, the region in the circumference of thenon-contact electrode in the thin film substrate sufficiently extends,the distance from the semiconductor wafer of the non-contact electrodecan be surely made small.

In this case, the probe card of the invention may further contain ananisotropically conductive sheet that is provided between the wiringsubstrate and the thin film substrate and contains an elastic materialconducting in a pressing direction between the first electrode and thethin film back surface electrode and the second electrode, in which thecontact area with the thin film back surface electrode in theanisotropically conductive sheet may be smaller than the contact areawith the first electrodes connected to the projection electrodes in theanisotropically conductive sheet.

In the probe card of the invention, when the pitch conversion substrateis provided, the non-contact electrode is an inductor for probing andeach semiconductor chip has an inductor for transmission and reception;and the pitch conversion substrate has a first inductor formed on theside of the semiconductor wafer and a second inductor formed on the sideof the wiring substrate and electrically connected to the firstinductor, in which the first inductor may be provided at a positionfacing the inductor for transmission and reception and the secondinductor may be provided at the position facing the inductor forprobing.

In the structure, even when the pitch conversion substrate is provided,signals can be surely transmitted and received between the semiconductorchip and the wiring substrate.

In this case, the first inductor and the second inductor may beconnected in such a manner that the mutual current directions may beopposite to each other.

Also in this case, the first inductor and the second inductor may bedisposed in such a manner that the center positions are different fromeach other in the front-back direction of the pitch conversionsubstrate.

Also in this case, the pitch conversion substrate may contain a magneticlayer at least in a region facing the inductor for transmission andreception.

Thus, interference of signals from other adjacent inductors can beprevented.

In the probe card of the invention, when the pitch conversion substrateis provided, the non-contact electrode is an inductor for probing andeach semiconductor chip has an inductor for transmission and reception;the inductor for probing and the inductor for transmission and receptionare opposite to each other; and the pitch conversion substrate may havea via containing a magnetic material in the direction of penetrating thepitch conversion substrate between the inductor for transmission andreception and the inductor for probing.

In the structure, diffusion of a magnetic field can be prevented, andthus a magnetic flux is efficiently led to the inductor for probing toincrease the electromagnetic coupling. Thus, stable inspection can beperformed.

In the probe card of the invention, the non-contact electrode is aninductor for probing and each semiconductor chip has an inductor fortransmission and reception; the inductor for probing and the inductorfor transmission and reception are opposite to each other; and the thinfilm substrate has, on the first surface, a amp bump electrodecontaining a magnetic material formed in such a manner as to penetrate aregion where the inductor for probing is formed.

Also in the structure, diffusion of a magnetic field can be prevented,and thus a magnetic flux is efficiently led to the inductor for probingto increase the electromagnetic coupling. Thus, stable inspection can beperformed.

The probe card of the invention may further have a probe chip that isformed in a region facing the thin film substrate in the wiringsubstrate and communicates with each semiconductor chip through thenon-contact electrode.

In the structure, the parasitic capacitance which poses a problemparticularly in the case of capacitive coupling can be suppressed to asmall level, and thus signals from the non-contact electrode of the thinfilm substrate can be surely transmitted and received.

In this case, the probe chip may be disposed in a concave portion formedin a region facing the thin film substrate.

Also in this case, the probe chip may be embedded in a region facing thethin film substrate.

A first semiconductor wafer inspection method using the probe cardaccording to the invention includes the steps of: preparing the probecard in which the first sealed space is formed and held between thewiring substrate and the thin film substrate; placing an inspectiontarget semiconductor wafer on a wafer stage, aligning the pad electrodesof each semiconductor chip in the semiconductor wafer and the projectionelectrodes of the probe card in which the first sealed space is formed;and reducing the pressure between the probe card and the wafer stage inthe aligned state to form the second sealed space, in which, in the stepof forming the second sealed space, the pressure of the second sealedspace is reduced while maintaining that the pressure of the first sealedspace is higher than the pressure of second sealed space.

According to the first semiconductor wafer inspection method, the secondsealed space is formed after the wiring substrate and the thin filmsubstrate between which the first sealed space is formed are alignedwith the semiconductor wafer placed on the wafer stage (wafer chuck). Inthe step of forming the second sealed space, by reducing the pressure ofthe second sealed space while maintaining that the pressure of the firstsealed space is higher than the pressure of the second sealed space, thethin film substrate contacting both the first sealed space and thesecond sealed space expands toward the semiconductor wafer. As a result,the non-contact electrode provided on the thin film substrate is broughtcloser to the pad electrode formed on the semiconductor chip, and thusthe electromagnetic coupling in a non-contact state increases to allowstable transmission and reception of signals.

A second semiconductor wafer inspection method using the probe cardaccording to the invention includes the steps of: preparing the probecard in which the first sealed space is formed and held between thewiring substrate and the thin film substrate; placing an inspectiontarget semiconductor wafer on a wafer stage; aligning the pad electrodesof each semiconductor chip in the semiconductor wafer and the projectionelectrodes of the probe card in which the first sealed space is formed;and reducing the pressure between the probe card and the wafer stage inthe aligned state to form the second sealed space, in which the step offorming the second sealed space has a step of reducing the pressure ofthe second sealed space to be the same as the pressure of the firstsealed space, and then increasing the pressure of the first sealed spaceto be higher than the pressure of second sealed space.

According to the second semiconductor wafer inspection method, the sameeffects as those of the first semiconductor wafer inspection method areobtained. Moreover, since the pressure of the second sealed space isreduced in such a manner as to be the same as the pressure of the firstsealed space, the extension of the thin film substrate can besuppressed. Thus, the position shift of the projection electrodes andthe non-contact electrode and the pad electrodes can be prevented.

In the first and second semiconductor wafer inspection methods, adifference between the pressure of the first sealed space and thepressure of the second sealed space is preferably 1 kPa or more and 30kPa or lower.

As described above, according to the probe card of the invention and thesemiconductor wafer inspection method using the same, when signals aretransmitted and received to/from the semiconductor wafer by capacitivecoupling or inductive coupling in a non-contact state, theelectromagnetic coupling further increases, and thus the signals can bestably transmitted and received.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partial schematic cross sectional view of a probe cardcontaining a thin film substrate and a wiring substrate according to afirst example embodiment.

FIG. 2 is a partial schematic cross sectional view of a probe cardcontaining a thin film substrate and an anisotropically conductive sheetaccording to a second example embodiment.

FIG. 3 is a partial schematic cross sectional view of a probe cardcontaining a thin film substrate, an anisotropically conductive sheet, apitch conversion substrate, and a wiring substrate according to a thirdexample embodiment.

FIGS. 4A and 4B show an example of a non-contact pattern of a thin filmsubstrate for use in the probe card according to each exampleembodiment: FIG. 4A is a partial schematic plan view and FIG. 4B is apartial schematic cross sectional view.

FIG. 5 is a graph of calculation results of a deflection degree by apressure for every film thickness of the thin film substrate for use inthe probe card according to a present disclosure.

FIGS. 6A and 6B show a first modification of a non-contact pattern ofthe thin film substrate for use in the probe card according to eachexample embodiment: FIG. 6A is a partial schematic plan view and FIG. 6Bis a partial schematic cross sectional view.

FIGS. 7A and 7B show a second modification of the non-contact pattern ofthe thin film substrate for use in the probe card according to eachexample embodiment: FIG. 7A is a partial schematic plan view and FIG. 7Bis a partial schematic cross sectional view.

FIG. 8 is a flow chart of a first semiconductor wafer inspection methodusing the probe card according to each example embodiment.

FIG. 9 is a flow chart of a second semiconductor wafer inspection methodusing the probe card according to each example embodiment.

FIG. 10A is a schematic perspective view of an example of the pitchconversion substrate which is a probe card according to a fourth exampleembodiment. FIG. 10B is a view showing the wire connection direction ofinductors.

FIG. 11 is a schematic perspective view of a first modification of thepitch conversion substrate, which is the probe card according to thefourth example embodiment.

FIG. 12 is a schematic perspective view of a second modification of thepitch conversion substrate, which is the probe card according to thefourth example embodiment.

FIG. 13 is a schematic perspective view of a third modification of thepitch conversion substrate, which is the probe card according to thefourth example embodiment.

FIG. 14A is a schematic cross sectional view of an example of a thinfilm substrate, which is a probe card according to a fifth exampleembodiment. FIG. 14B is an enlarged cross sectional view of FIG. 14A.

FIG. 15 is a schematic perspective view of an example of a wiringsubstrate and a thin film substrate, which is a probe card according toa sixth example embodiment.

FIG. 16 is a schematic perspective view of a first modification of thewiring substrate, which is the probe card according to the sixth exampleembodiment.

FIG. 17 is a schematic perspective view of a second modification of thewiring substrate, which is the probe card according to a sixth exampleembodiment.

DETAILED DESCRIPTION First Example Embodiment

A probe card according to a first example embodiment will be describedwith reference to FIG. 1.

As shown in FIG. 1, the probe card 1 according to the first exampleembodiment contains a wiring substrate 2 and a thin film substrate 3. Onthe surface facing the thin film substrate 3 in the wiring substrate 2,electrodes 21 a and an electrode 21 b are formed. The electrodes 21 amainly supply electric power to a wafer 4 which is an inspection targetand the electrode 21 b transmits and receives inspection signals to/fromthe wafer 4. Here, the electrodes 21 a are preferably formed by platingor the like so that the thickness thereof is larger than that of theelectrode 21 b.

The thin film substrate 3 is manufactured using, for example, atwo-layer base material of a polyimide thin film and a copper thin filmor a three-layer base material in which copper thin films are pasted toeach other with an adhesive. Laser light or the like is emitted from thepolyimide side to form penetration holes through which the copper filmis exposed. Furthermore, bump electrodes 3 a containing nickel, copper,or an alloy thereof are formed through the penetration holes by anelectric field plating method, an electroless plating method, or thelike. On the back side of each of the bump electrodes 3 a in the thinfilm substrate 3, bump back surface electrodes 3 a 2 each to beelectrically connected to each of the bump electrodes 3 a are formed.

A non-contact pattern 3 b for obtaining capacitive coupling or inductivecoupling provided on the thin film substrate 3 may be formed by etchingthe copper thin film of the thin film substrate 3 itself. Moreover, thenon-contact pattern 3 b may be formed by once removing a region wherethe non-contact pattern 3 b is formed in the copper foil, forming a thinfilm metal layer again by a sputtering method or the like, and thenetching the formed thin film metal layer. When the thin film metal layeris formed by a sputtering method or the like, a thinner metal layer canbe formed. Thus, there is an advantage in that fine processing can beachieved. In the case of the thin film metal layer, a finer pattern canbe formed by processing using laser light or the like. Thus, the thinfilm metal layer is suitable for forming an inductor (coil) or the likeforming an inductive coupling pattern.

The bump electrodes 3 a each are formed at the positions facing theelectrodes 21 a of the wiring substrate 2 and the pad electrodes 4 a forinspection of the wafer 4. The non-contact pattern 3 b is formed at theposition facing each of the electrode 21 b of the wiring substrate 2 andthe non-contact pad 4 b for inspection of the wafer 4. The non-contactpattern 3 b is connected to the electrode 21 b of the wiring substrate 2via a conductive member 23 having flexibility or elasticity. Theconductive member 23 having elasticity may be constituted by, forexample, a ring-shaped hollow metal member as shown in FIG. 1 orblending conductive particles or a conductive wire into a siliconerubber. The conductive member 23 may be attached so that the thin filmsubstrate 3 is pushed out toward the wafer 4 by the elasticity or thethin film substrate 3 may be attached in such a manner as to maintain anapproximately parallel state to the principal surface of the wafer 4.The portion to be electrically connected to the electrode 21 b of thewiring substrate 2 and the portion to be electrically connected to thenon-contact pattern 3 b are preferably fixed by a conductive adhesive ora soldering material. In particular, when connected by the conductivemember 23 having flexibility, the portions need to be fixed.

In FIG. 1, the non-contact pattern 3 b is a capacitive coupling pattern,which is vertically drawn out from one non-contact pattern 3 b by theconductive member 23 having elasticity. When an inductive couplingpattern (inductor) is used in place of the capacitive coupling pattern,a current signal needs to be transmitted to the inductor, and thus thesignal current needs to be input from one terminal of the inductor andto be output from the other terminal. Therefore, the electrode 21 b isprovided on each of the current input side and the current output side.When a plurality of the non-contact pattern 3 b that perform inductivecoupling are formed in an adjacent manner, one electrode of eachinductor can be shared. Thus, the number of the electrodes 21 b may belarger by one than the number of inductive coupling patterns. In thiscase, a pair of electrodes 21 b connected to the non-contact pattern 3 bforming one inductive coupling are preferably disposed immediately abovethe non-contact pattern 3 b. However, when it is difficult to disposethe same immediately above the non-contact pattern 3 b due to alimitation of processing techniques or the pattern shape, the electrodes21 b may not be disposed immediately above the non-contact pattern 3 bbut are preferably disposed closer to the non-contact pattern 3 b asmuch as possible.

The space sandwiched between the wiring substrate 2 and the thin filmsubstrate 3 is sealed along the outer periphery (not shown) to form afirst sealed space 5. In the first example embodiment, the wiringsubstrate 2 is provided with a penetration hole 24 so that the airpressure of the first sealed space 5 can be arbitrarily adjusted. To thepenetration hole 24, a pipe 24 a is connected and a pressure adjustingvalve (not shown) is connected to the tip.

The space sandwiched between the thin film substrate 3 and the wafer 4is sealed along the outer periphery to form a second sealed space 51(not shown).

The probe card 1 structured as described above is aligned with the wafer4 by an alignment device, and the pad electrodes 4 a are connected tothe bump electrodes 3 a, respectively, of the probe card 1 and thenon-contact pad 4 b is brought close to the non-contact pattern 3 b.Furthermore, by increasing the pressure of the first sealed space 5 tobe higher than the pressure of the second sealed space 51 on the wafer 4through the penetration hole 24, the thin film substrate 3 is expandedtoward the wafer 4. Thus, the non-contact pattern 3 a provided on thethin film substrate 3 is brought into close contact with the non-contactpad 4 b on the wafer 4.

On the wiring substrate 2, a plurality of wirings 22 for inspecting thewafer 4 are provided and are connected to a power supply, a signalgenerator, a comparator for judging each signal, and the like. As aresult of transmitting and receiving inspection signals to/from thenon-contact pad 4 b provided on the wafer 4 through non-contactcoupling, electrical inspection can be carried out. The signalstransmitted and received through non-contact coupling are very weak inmany cases, and the signals transmitted to the wafer 4 are sensed,amplified, and modulated in the wafer 4 to be used for the inspection ofeach semiconductor chip in the wafer 4. The signals from the wafer 4 aresensed, amplified, and modulated with a probe chip (not shown) mountedon the probe card 1 to be used for the judgment of inspection results.Since the signals are weak, the probe chip is preferably disposed closeto the non-contact pattern 3 b of the probe card 1 (wiring substrate 2)as much as possible as described in detail in the sixth exampleembodiment.

Thus, according to the first example embodiment, signals can betransmitted and received to/from the wafer 4 without substantiallyrequiring a load even when the data volume of a signal wire is large.Thus, more complicated inspection can be achieved and collectiveinspection of the wafer 4 is facilitated.

Second Example Embodiment

Hereinafter, a second example embodiment will be described withreference to FIG. 2. In FIG. 2, the same constituent members as those inFIG. 1 are designated by the same reference characters and thedescription is omitted.

As shown in FIG. 2, the second example embodiment is different from thefirst example embodiment in that an anisotropically conductive sheet 6containing an elastic material through which the bump electrodes 3 a andthe electrodes 21 a and the non-contact pattern 3 b and the electrode 21b are electrically connected to each other only in the pressingdirection is provided between the wiring substrate 2 and the thin filmsubstrate 3.

The anisotropically conductive sheet 6 is a member that connects thewiring substrate 2 and the thin film substrate 3 while having elasticityand contains a material having insulation properties in the in-planedirection of the sheet and having conductivity in the directionperpendicular to the principal surface of the sheet.

Examples of the materials and structures having such properties include:

1) a structure such that conductive particles are localized anddispersed in elastic materials, such as silicone rubber, and thencompressed, so that the conductive particles contact each other, wherebyelectrical connection is achieved only in the compression direction;2) a structures such that a conductive wire is embedded in an elasticmaterial, such as silicone rubber, in the direction perpendicular to theprincipal surface and both ends are exposed, and3) a structure such that penetration holes are selectively formed in aporous resin material containing Teflon or the like having elasticity,and the inner wall of the penetration holes is covered with a conductivematerial in such a manner as to leave the elasticity.

By disposing the anisotropically conductive sheet 6 having elasticitybetween the wiring substrate 2 and the thin film substrate 3, thevariation in the height of the bump electrodes 3 a provided on the thinfilm substrate 3, the curvature and irregularities of the wiringsubstrate 2, and the like are absorbed. Thus, the electrical connectionbetween the semiconductor wafer 4 and the wiring substrate 2 can bestably achieved.

In the second example embodiment shown in FIG. 2, the anisotropicallyconductive sheet 6 having the structure described in 1) above is used.It is a matter of course that when materials having the structures of 2)and 3) above and showing the same properties as those of theanisotropically conductive sheet 6 are used in place of the structureof 1) above, the same effects can be obtained.

The anisotropically conductive sheet 6 shown in FIG. 2 is furtherprovided with conductive parts 61 a and 61 b facing the bump electrodes3 a and the like by locally disposing conductive particles. Theconductive parts 61 a and 61 b are held by a frame 62 containing a rigidmaterial whose linear expansion coefficient is adjusted to be close tothe linear expansion coefficient of silicon (Si). Thus, not only thatthe initial position accuracy is secured but also that the positionaccuracy can be maintained at a high level to the measurementtemperature during measurement of an inspection. The conductive parts 61a and 62 b locally disposed on the anisotropically conductive sheet 6are preferably formed projecting from the principal surface of the frame62. Thus, a higher pressing force for ensuring the contact between theparticles constituting the conductive parts 61 a and 62 b can besecured.

During pressing, the conductive parts 61 a are electrically connected tothe bump electrodes 3 a of the thin film substrate 3 and the conductivepart 61 b is electrically connected to the non-contact pattern 3 b ofthe thin film substrate 3. Here, the cross sectional area of theconductive part 61 b to be connected to the non-contact pattern 3 b ispreferably smaller than the cross sectional area of the conductive parts61 a to be connected to the bump electrodes 3 a. This results from thefact that the non-contact pattern 3 b does not require electricalconnection by contacting and this is because a high pressing force isnot required due to contacting portions where the bump electrodes 3 aare not formed on the thin film substrate 3 and there is no necessity ofapplying a high current unlike a power supply or the like.

Third Example Embodiment

Hereinafter, a third example embodiment will be described with referenceto FIG. 3. In FIG. 3, the same constituent members as those in FIG. 1are designated by the same reference characters and the description isomitted.

As shown in FIG. 3, the third example embodiment is different from thesecond example embodiment in that a pitch conversion substrate 7 and asecond anisotropically conductive sheet 8 containing an elastic materialis disposed between the wiring substrate 2 and the anisotropicallyconductive sheet 6 containing an elastic material (here referred to asthe first anisotropically conductive sheet 6).

With the structure, even when the type of the wafer 4 as an inspectiontarget varies and, with the variation, the arrangement of the padelectrodes 4 a and the non-contact pad 4 b varies, the wiring substrate2 does not need to change whenever the type thereof varies and only thethin film substrate 3, the first anisotropically conductive sheet 6, andthe pitch conversion substrate 7 may be merely replaced by thosecorresponding to the new type. More specifically, the type of the wafer4 can be changed easily and at a low cost. Also in the wiring substrate2, the electrodes 21 a and 21 b corresponding to the electrode pads 4 a,the non-contact pad 4 b, and the like on the wafer 4 do not need to befinely processed. Thus, also in this respect, the probe card 1 can beproduced at a low cost.

The structure of the pitch conversion substrate 7 will be described indetail. For example, on the surface facing the wafer 4, a plurality ofpitch conversion electrodes 71 a facing the pad electrodes 4 a of thewafer 4 are formed and, on the surface that is the back surface andfaces the wiring substrate 2, a plurality of back surface electrodes 71b having an increased pitch are formed. The pitch conversion electrodes71 a and the back surface electrodes 71 b each are electricallyconnected by internal wirings 72.

Moreover, as shown in FIG. 3, spaces 5 a and 5 b of both surfaces of thepitch conversion substrate 7 are sealed along the outer periphery (notshown) to form a first sealed space 5. In the pitch conversion substrate7, a penetration hole 74 that connects the spaces 5 a and 5 b ispreferably selectively formed. Thus, the air pressure of the firstsealed space 5 can be arbitrarily adjusted from the outside through thepenetration hole 24 provided in the wiring substrate 2. However, thepenetration hole 74 to be provided in the pitch conversion substrate 7is not essential and the spaces 5 a and 5 b may communicate in theperipheral part of the pitch conversion substrate 7. The advantages offorming the penetration hole 74 in the pitch conversion substrate 7resides in that the pressure difference between the spaces 5 a and 5 bof both surfaces of the pitch conversion substrate 7 is promptlycleared.

For the materials constituting the second anisotropically conductivesheet 8, the same materials and structures as those of the firstanisotropically conductive sheet can be used. Conductive parts 81 alocally disposed on the second anisotropically conductive sheet 8 eachare disposed in such a manner as to contact the electrodes 21 a and 21 bon the side of the wiring substrate 2 and contact the back surfaceelectrodes 71 b on the side of the pitch conversion substrate 7.

Hereinafter, the structure and the optimal arrangement of thenon-contact pattern 3 b on the thin film substrate 3 will be describedwith reference to FIGS. 4A and 4B.

FIG. 4A shows the plane structure (as viewed from the back surface ofthe bump electrode 3 a) of the thin film substrate 3 and FIG. 4Bschematically shows the cross-sectional structure of the thin filmsubstrate 3 when a differential pressure is applied to the first sealedspace 5 and the second sealed space 51.

The bump electrodes 3 a are connected to the bump back surfaceelectrodes 3 a 2 through penetration holes 3 a 1 provided in the thinfilm substrate 3.

In contrast, the non-contact pattern 3 b is formed on the wafer side(bump electrode 3 side) of the thin film substrate 3 in such a manner asto be closer to the wafer and is drawn out to the vicinity of the bumpelectrodes 3 a via a non-contact pattern wiring 3 b 4. A surfaceelectrode 3 b 3 connected to the non-contact pattern wiring 3 b 4 isconnected to a back surface electrode 3 b 2 through a penetration hole 3b 1 formed in the thin film substrate 3. The back surface electrode 3 b2 connected to the non-contact pattern 3 b contacts the conductivemember 23 shown in FIG. 1 or the conductive part 61 b for thenon-contact pattern 3 b in the anisotropically conductive sheet 6 shownin FIG. 2.

As shown in FIG. 4B, by applying a differential pressure to the internalpressure of the first sealed space 5 above the thin film substrate 3 andthe second sealed space 51 below the thin film substrate 3, thenon-contact pattern 3 b can be brought close to the wafer (not shown).Therefore, the non-contact pattern 3 b is preferably disposed apart froma bump line formed with the bump electrodes 3 a by a distance at least10 times the thickness t of a base material constituting the thin filmsubstrate 3. For example, when a polyimide having a thickness t of 25 μmis used as the base material of the thin film substrate 3, an interval cis 250 μm or more. When the interval is adjusted to the degree, the thinfilm substrate 3 can be sufficiently deflected even when the height ofthe bump electrode 3 a is adjusted to, for example, 20 μm. Therefore,the non-contact pattern 3 b can be brought into contact with the waferwithout substantially causing position shift relative to the non-contactpad of the wafer.

The interval c is affected by not only the thickness t of the thin filmsubstrate 3 but also the rigidity (Young's modulus) of the thin filmbase material, the tension of the thin film substrate 3 when the thinfilm substrate 3 has the tension, the differential pressure between thepressure of the first sealed space 5 and the pressure of the secondsealed space, etc. When capacitive coupling is used for the non-contactpattern 3 b, the capacity of the wiring attenuates the signal level as aparasitic capacitance compared with coupling capacity. Thus, the wiringis preferably shortened as much as possible. Similarly, the line widthof the non-contact pattern wiring 3 b 4 is also preferably reduced fromthe viewpoint of reducing the parasitic capacitance.

FIG. 5 shows calculation results of a differential pressure to beapplied to the first sealed space and the second sealed space and adeflection degree of a polyimide film when a polyimide (UPILEX,manufactured by Ube Industries, Ltd.) having a film thickness of 25 μmand a polyimide (XENOMAX, manufactured by Toyobo Co., Ltd.) having afilm thickness of 5 μm are used as the base material of the thin filmsubstrate 3. FIG. 5 shows that when the height of the bump electrode is25 μm and a differential pressure of about 30 kPa is applied to thepolyimide film having a film thickness of 25 μm, the polyimide film isbrought into close contact with the wafer at the position apart from thebump electrode by only about 700 μm. The extension of the polyimide filmat this time is about 0.54 μm.

It is also found that when the height of the bump is 20 μm and thepolyimide film has a film thickness of 5 μm and a differential pressureof about 6 kPa is applied, the polyimide film is brought into closecontact with the wafer at the position apart from the bump electrode byonly about 300 μm. The extension of the polyimide film at this time isabout 0.89 μm.

Thus, the position of the non-contact pattern 3 b shifts by about 0.89μm under the worst conditions (when the bump electrode is not present onthe bump side and the back surface of the non-contact pattern and thepolyimide film is brought close to the wafer, and thus the positionshift occurs corresponding to the deflection degree). Accordingly, thethin film substrate 3 can be designed and manufactured withoutsubstantially considering the position shift.

The back surface electrode 3 b 2 for non-contact pattern is preferablyformed so that the area is smaller than that of with the bump backsurface electrode 3 a 2. This is because, in the structure, the area incontact with the anisotropically conductive sheet 6 in the back surfaceelectrode 3 b 2 becomes small, and connection can be carried out withoutstrongly pressing the thin film substrate 3. This is because the padelectrodes 4 a on the wafer that are pressed by the bump electrodes 3 ato be brought into contact therewith is usually formed with aluminum orthe like, and electrical conduction is not achieved without a certaindegree of load, and, in contrast thereto, the back surface electrode 3 b2 for non-contact pattern can achieve stable electrical connection at alow load by performing metal plating or the like.

Hereinafter, a first modification of the non-contact pattern 3 b will bedescribed with reference to FIGS. 6A and 6B.

As shown in FIGS. 6A and 6B, the non-contact pattern 3 b according to afirst modification is different from the non-contact pattern 3 b shownin FIG. 4 in that the surface electrode 3 b 3 is omitted and the backsurface electrode 3 b 2 is shared. Thus, the non-contact pattern wiring3 b 4 and the penetration hole 3 b 1 become unnecessary. The backsurface electrode 3 b 2 contacts the conductive member 23 shown in FIG.1 or the conductive part 61 b for the non-contact pattern 3 b on theanisotropically conductive sheet 6 shown in FIG. 2.

According to this modification, since the non-contact pattern wiring 3 b4 is not formed, the parasitic capacitance corresponding to the omissioncan be suppressed at a low level.

Hereinafter, a second modification of the non-contact pattern 3 b willbe described with reference to FIGS. 7A and 7B.

As shown in FIGS. 7A and 7B, the non-contact pattern 3 b according to asecond modification is different from the non-contact pattern 3 b shownin FIG. 4 in that the back surface electrode 3 b 2 is formed in thenon-contact pattern 3 b (surface electrode 3 b 3) itself through thepenetration hole 3 b 1. Accordingly, the non-contact pattern wiring 3 b4 becomes unnecessary. The back surface electrode 3 b 2 contacts theconductive member 23 shown in FIG. 1 or the conductive part 61 b for thenon-contact pattern 3 b on the anisotropically conductive sheet 6 shownin FIG. 2.

In the second modification, when capacitive coupling is used for thenon-contact pattern 3 b, the distance from the capacitor on the waferbecomes large corresponding to the film thickness of the thin filmsubstrate 3. Thus, a reduction in the coupling capacity is concerned.Accordingly, for the thin film substrate 3, a thin film base materialhaving a large dielectric constant and a small film thickness ispreferably used. In order to form the penetration hole 3 b 1, the thinfilm base material may be subjected to chemical etching or may beprocessed by a mechanical physical method including laser light from theback side of the bump electrode 3.

As a more effective aspect of the modifications described using FIGS. 6and 7, the conductive part 61 b for non-contact pattern in theanisotropically conductive sheet 6 to be connected to the back surfaceelectrode 3 b 2 of the non-contact pattern 3 b preferably projects fromthe principal surface of the sheet. Furthermore, the projection portionis preferably smaller than the projection area of a portion to beconnected to the bump back surface electrode 3 a 2. Thus, conductionwith the non-contact pattern 3 b can be achieved at a low load.

(First Semiconductor Wafer Inspection Method)

Hereinafter, a first semiconductor wafer inspection method using theprobe cards according to the example embodiments 1 to 3 and themodifications thereof will be described with reference to FIG. 8.

As shown in FIG. 8, in a step S01, the wafer 4 on which a plurality ofsemiconductor chips each containing a semiconductor integrated circuitto be inspected are formed is loaded on the wafer stage (wafer chuck).

Simultaneously therewith, in a step S02, the probe card 1 in which thefirst sealed space 5 is formed and held between the wiring substrate 2and the thin film substrate 3 is prepared.

Next, in a step S03, the pad electrodes 4 a and the non-contact pad 4 bof each semiconductor chip on the wafer 4 and the bump electrodes 3 aand the non-contact pattern 3 b of the probe card 1 in which the firstsealed space 5 is formed are aligned, respectively. Thereafter, they arebrought close to each other to bring the probe card 1 and thesemiconductor wafer 4 into close contact with each other. During thestep, a seal ring provided in the periphery of the wafer 4 on the waferstage contacts the probe card 1 to form the second sealed space 51between the wafer 4 (wafer stage) and the probe card 1.

Next, in a step S04, the pressure of the second sealed space 51 isreduced while maintaining the pressure (internal pressure) of the firstsealed space 5 to be always higher than the pressure (internal pressure)of the second sealed space 51 by a differential pressure of from about 1kPa to 30 kPa. When the reduction in the pressure of the second sealedspace 51 is completed, the bump vamp electrodes 3 a of the thin filmsubstrate 3 contact the pad electrodes 4 a of the wafer 4 to obtainelectrical conduction and the non-contact pattern 3 b of the thin filmsubstrate 3 is brought close to the non-contact pad 4 b to formnon-contact coupling.

Thus, the probe card 1 and the wafer 4 that are mutually aligned andbrought into contact with each other are connected to a tester chiphaving an inspection function provided on the probe card 1, a probe chipfor transmitting and receiving non-contact signals, or a tester disposedoutside the probe card 1, and desired inspection is carried out.

During the step, the bump electrodes 3 a of the thin film substrate 3are pressed against the pad electrodes 4 a of the wafer 4 by a pressuredifference between a pressure difference between the external pressure(usually atmospheric pressure) and the pressure of the second sealedspace 51 and a pressure difference of the external pressure (usuallyatmospheric pressure) and the pressure of the first sealed space 5.Furthermore, the non-contact pattern 3 b of the thin film substrate 3 isbrought close to the wafer 4 by a pressure difference between thepressure of the second sealed space 51 on the wafer 4 and the pressureof the first sealed space 5 in the probe card 1.

Thus, in the first inspection method, the pressure of the second sealedspace 51 is reduced while always giving a differential pressure betweenthe first sealed space 5 and the second sealed space 51. Thus, when thereduction in the pressure is completed, the non-contact pattern 3 b isalso brought close to the non-contact pad 4 b of the wafer 4.Accordingly, immediately after the step, given inspection can beinitiated.

(Second Semiconductor Wafer Inspection Method)

Hereinafter, a second semiconductor wafer inspection method using theprobe cards according to the example embodiments 1 to 3 and themodifications thereof will be described with reference to FIG. 9.

Only steps different from those of the first inspection method shown inFIG. 8 will be described.

First, in a step S03, the second sealed space 51 that is already alignedis formed between the wafer 4 and probe card 1 in the same manner as inthe first inspection method.

Subsequently, in a step S14, the pressure of the second sealed space 51is reduced while maintaining the pressure of the first sealed space 5 tobe always equal to the pressure of the second sealed space 51. Thus, thebump electrodes 3 a of the thin film substrate 3 contact the padelectrodes 4 a of the wafer 4 to obtain electrical conduction.

Next, in a step S15, after the completion of the reduction in thepressure of the first sealed space 5 and the second sealed space 51, adifferential pressure is given to the first sealed space 5 so that thepressure of the first sealed space 5 is higher than the pressure of thesecond sealed space 51 by from about 1 kPa to about 30 kPa. Due to thedifferential pressure, the non-contact pattern 3 b of the thin filmsubstrate 3 is brought close to the non-contact pad 4 b of the wafer 4to form non-contact coupling.

Thus, also in the second inspection method, the probe card 1 and thewafer 4 that are mutually aligned and brought into contact with eachother are connected to a tester chip having an inspection functionprovided on the probe card 1, a probe chip for transmitting andreceiving non-contact signals, or a tester disposed outside the probecard 1, and desired inspection is carried out.

Furthermore, in the second inspection method, since the non-contactpattern 3 b and the non-contact pad 4 b are brought close to each otherafter the bump electrode 3 a are pressed against the pad electrodes 4 a,the alignment accuracy can be maintained at a very high level.

Fourth Example Embodiment

Hereinafter, an example of the pitch conversion substrate used in thethird example embodiment, which is a probe card according to a fourthexample embodiment, will be described with reference to FIG. 10. Here,the pitch conversion electrode 71 a and the back surface electrode 71 bare omitted.

As described in the third example embodiment shown in FIG. 3, it ishighly advantageous in terms of the cost to form a probe chip on awiring substrate and re-utilize the wiring substrate 2 on which anexpensive probe chip is mounted when changing the type of asemiconductor wafer (semiconductor chip) using the pitch conversionsubstrate 7. However, since the pitch conversion substrate 7 is pressedby the first anisotropically conductive sheet 6 and the secondanisotropically conductive sheet 8, the pitch conversion substrate 7needs to have a certain degree of rigidity. Accordingly, a thickness ofabout 1 mm is usually required. In contrast, in inductive coupling,mutual inductance becomes rapidly small when being apart by a distanceequal to or larger than the diameter of an inductor coil constitutingthe same. For inductive coupling with the wafer 4, it is assumed to usea coil of about 10 to about 200 μm. A coil having such a dimension isvery difficult to be coupled with a probe chip for communication overthe pitch conversion substrate 7 having a thickness of about 1 mm.

Then, in this example embodiment, as shown in FIG. 10A, it is preferablethat, by forming a first inductor 75 a and a second inductor 75 b oneach of the wafer side and the wiring substrate side in the pitchconversion substrate 7, and then coupling the indictors, both theinductors 75 a and 75 b be connected by an electrical signal.

In this case, as shown in FIG. 10 B, with respect to the windingdirection of the coil in both the inductors 75 a and 75 b, the coil ismore preferably wound so that current may flow in the mutually oppositedirection. Thus, the direction of a magnetic field formed by a currentinduced by the first inductor 75 a is the same as the direction of amagnetic field formed by the non-contact pad 4 b of the wafer. Thus, amutually cancelling phenomenon can be prevented. The same applies whenthe magnetic field is changed from the probe chip side to transmitsignals to the wafer side.

First Modification of Fourth Example Embodiment

Hereinafter, a first modification of the pitch conversion substrate,which is the probe card according to the fourth example embodiment, willbe described with reference to FIG. 11. Here, the pitch conversionelectrode 71 a and the back surface electrode 71 b are also omitted.

As shown in FIG. 11, in the first modification, the first inductor 75 aand the second inductor 75 b provided on both sides of the pitchconversion substrate 7 are not formed on the same axis. Morespecifically, the first inductor 75 a and the second inductor 75 b aredisposed so that the center positions are different from each other.

Thus, the first inductor 75 a facing the wafer 4 can be disposed at theposition facing the inductive non-contact pad 4 b in the wafer 4 and thesecond inductor 75 b facing the wiring substrate can be disposed at theposition facing the probe chip in the wiring substrate. Thus, the firstinductor 75 a and the second inductor 75 b can be disposed at suitablepositions.

The current direction when the first inductor 75 a and the secondinductor 75 b in the first modification are connected may be determinedas appropriate based on the relationship of the magnetic fields formedby the inductors depending on the positional relationship of thenon-contact pad 4 b formed on the wafer 4 and the non-contact pattern ofthe probe chip (not shown) mounted on the wiring substrate.

Second Modification of Fourth Example Embodiment

Hereinafter, a second modification of the pitch conversion substrate,which is the probe card according to the fourth example embodiment, willbe described with reference to FIG. 12. Here, the pitch conversionelectrode 71 a and the back surface electrode 71 b are also omitted.

As shown in FIG. 12, in the second modification, a magnetic layer 76 isformed in the pitch conversion substrate 7 in parallel to the principalsurface. The magnetic layer 76 has an effect of shielding the magneticfield, and thus the first inductor 75 a and the second inductor 75 b fornon-contact communication provided on both surfaces of the pitchconversion substrate 7 can shield effects of the magnetic field formedby an electrode pattern for non-contact communication in the probe chipon the wafer 4 or the wiring substrate on the surface which eachinductor faces. Here, as an example of the magnetic layer 76, Invaralloy (iron alloy containing about 36% of nickel) can be used.

According to the second modification, the first inductor 75 a and thesecond inductor 75 b of the pitch conversion substrate 7 can be disposedon arbitrary positions and can be interconnected without considering thearrangement of the non-contact pad 4 b at all. Moreover, in this case,the necessity of considering the interconnection direction is hardlyrequired, and thus the degree of freedom of design can be sharplyimproved.

The magnetic layer 76 does not need to be formed over the entire surfaceof the pitch conversion substrate 7 and may cover a region equal to orlarger than the plane area of each of the inductor 75 a and 75 bprovided on both surfaces of the pitch conversion substrate 7.Accordingly, the effects can be obtained even when the magnetic layer 76is formed only in a part of pitch conversion substrate 7 due tolimitations of the cost of the magnetic material, the coefficient ofthermal expansion coefficient of the magnetic material, the formation ofa penetration hole for conducting the front and back sides due to thefact that magnetic material has conductivity, and the like.

The magnetic material for use in the magnetic layer 76 preferably has ahigh magnetic permeability and a small residual magnetic field. Thus,energy loss during high frequency communication can also be suppressed.

Third Modification of Fourth Example Embodiment

Hereinafter, a third modification of the wiring substrate and the pitchconversion substrate, which is the probe card according to the fourthexample embodiment, will be described with reference to FIG. 13. Here,the electrodes 21 a and 21 b and the wiring 22 in the wiring substrate2, the pitch conversion electrode 71 a and the back surface electrode 71b in the pitch conversion substrate 7, and the second anisotropicallyconductive sheet 8 that electrically connects the pitch conversionsubstrate 7 and the wiring substrate 2 are omitted.

As shown in FIG. 13, a via 77 containing a magnetic material forinducing a magnetic field is embedded in the direction of penetratingthe pitch conversion substrate 7 in the pitch conversion substrate 7according to the third modification. Thus, a reduction in magnetic fieldcoupling between the non-contact patterns for obtaining inductivecoupling formed on a probe chip 25 and the wafer 4 provided on thewiring substrate 2 due to an increase in the distance can be suppressed.

In order to further increase the effect of suppressing the reduction inmagnetic field coupling, the via 77 containing a magnetic materialpreferably projects from the surface of the pitch conversion substrate 7in the range where the constituent of the probe card 1 is not impaired.Thus, the via 77 is easily brought close to the non-contact pattern ofeach of the non-contact pad 4 b in the wafer 4 and of the probe chip 25in the wiring substrate 2.

As the magnetic material, in order to achieve high frequencycommunication, a soft magnetic material having a small residual magneticfield is preferably used.

Fifth Example Embodiment

Hereinafter, an example of the thin film substrate, which is a probecard according to a fifth example embodiment, will be described withreference to FIG. 14.

As shown in FIG. 14A, on the upper surface (wiring substrate side) ofthe thin film substrate 3, which is the thin film substrate 3 forcomparison, two non-contact pattern 3 b each containing an inductor areformed. On one of the non-contact pattern 3 b, a bump electrode 31containing a magnetic material and penetrating the thin film basematerial is formed.

As shown in FIG. 14B, when the space between the thin film substrate 3and the wafers 4 is air, a magnetic flux produced by signals in theinductive non-contact pad 4 b provided on the wafer 4 extends as it isapart from the surface of the wafer 4 and a magnetic flux passingthrough the inside of the non-contact pattern 3 b provided on the thinfilm substrate 3 decreases with an increase in the distance with thewafer 4.

However, as in the fifth example embodiment, by disposing the bumpelectrode 31 containing a magnetic material, such as nickel, on the axisof the non-contact pad 4 b, a magnetic field passes through the insideof the bump electrode 31 containing a magnetic material and theextension of the magnetic flux is suppressed, and thus the inductivecoupling can be increased. Thus, weak signals from the wafer 4 aredetected, and desired communication can be performed.

Sixth Example Embodiment

Hereinafter, an example of the wiring substrate and the thin filmsubstrate, which is a probe card according to a sixth exampleembodiment, will be described with reference to FIG. 15.

The probe card 1 according to this disclosure contains the wiringsubstrate 2 and the thin film substrate 3, and, on the surface facingthe thin film substrate 3 in the wiring substrate 2, the electrodes 21 aand 21 b are formed as shown in FIG. 1.

In the sixth example embodiment, an active device (chip) to be mountedon the wiring substrate 2 will be described. As shown in FIG. 15, theprobe chip 25 is mounted on the surface facing the wafer 4 in the wiringsubstrate 2. Moreover, a tester chip 26 is mounted on the surfaceopposite to the wafer 4 in the wiring substrate 2. Furthermore, althoughnot shown, passive components, such as a DC/DC converter for powersupply, a resistor, and a capacitor, may be mounted on the surfacefacing the wafer 4 of the wiring substrate 2.

The probe chip 25 formed on the thin film substrate 3 and facing thenon-contact pattern 3 b containing an inductor, for example, is providedwith a driver circuit for performing non-contact communication with thewafer 4 or a circuit for performing sensing, amplification,waveform-shaping, and the like of signals obtained from the wafer 4 bynon-contact. The probe chip 25 may contain one chip and may be connectedto one of the semiconductor chips on the wafer 4 by a single signal wireor a plurality of signal wires. A structure of simultaneouslycommunicating with a plurality of semiconductor chips with one chip maybe acceptable. Furthermore, a structure such that a plurality of theprobe chips 25 communicate with one semiconductor chip may beacceptable. Moreover, the probe chip 25 may have a driver circuit ofsignals for contact without being limited to the driver for non-contactcommunication. Furthermore, by providing a comparator, comparativeinspection of the obtained signal from the wafer 4 can be performed inthe probe chip 25.

The tester chip 26 transmits and receives signals to/from the probe chip25. One tester chip 26 may be connected to one probe chip 25 or onetester chip 26 may control a plurality of probe chips 25 and transmitand receive signals. The tester chip 26 may control the voltage of aDC/DC converter provided on one wiring substrate 2 and manage theconverter. When two or more of the tester chips 26 are mounted on oneprobe card 1, the plurality of the tester chips 26 simultaneouslyoperate, and thus they are preferably mutually connected to constitute anetwork.

Thus, in the sixth example embodiment, by disposing the probe chip 25 atthe surface facing the wafer 4 of the wiring substrate 2, it can beconnected to the non-contact pattern 3 b of the thin film substrate 3without passing through complicated inner layers of the wiring substrate2. Therefore, a possibility of influence of noise, such as cross talk,can be sharply reduced. In particular, when capacitive coupling is usedfor non-contact communication, parasitic capacitance ingredients can besharply reduced, and thus non-contact coupling having a high signalquality can be achieved.

By separating the probe chip 25 from the tester chip 26 for exclusivelyperforming inspection, the mounting area of the back surface (surfaceopposite to the wafer 4) of the probe card 1 can be effectivelyutilized.

By limiting the function of the probe chip 25 mainly to transmission andreception of signals, the consumption current of the probe chip 25 canbe suppressed. Therefore, it becomes unnecessary to take a specialmeasure against heat dissipation, it can be mounted on the inside of theprobe card 1.

First Modification of Sixth Example Embodiment

Hereinafter, a first modification of the wiring substrate, which is aprobe card according to the sixth example embodiment, will be describedwith reference to FIG. 16. Here, only the wiring substrate 2 is shown.

As shown in FIG. 16, the wiring substrate 2 according to a firstmodification is characterized in that the probe chip 25 is mounted in aconcave portion (hollow) 27 provided on the surface facing the wafer inthe wiring substrate 2.

The probe chip 25 preferably does not project from the surface of thewafer side of the wiring substrate 2 in a state where it is mounted onthe wiring substrate 2. Accordingly, in the first modification, bymounting the probe chip 25 in the concave portion 27 formed in thesurface of the wafer side of the wiring substrate 2, the projectionportion formed by mounting the probe chip 25 on the surface of the waferside of the wiring substrate 2 can be eliminated. Therefore, problems ofthe thickness of the electrodes 21 a provided on the wiring substrate 2and the thickness of the first anisotropically conductive sheet 6, thesecond anisotropically conductive sheet, or the like and concern ofin-plane uniformity when performing uniform pressurization to the wiringsubstrate 2 when carrying out each of the first to third exampleembodiments can be made small.

Second Modification of Sixth Example Embodiment

Hereinafter, a second modification of the wiring substrate, which is theprobe card according to the sixth example embodiment, will be describedwith reference to FIG. 17. Here, only the wiring substrate 2 is shown.

As shown in FIG. 17, the wiring substrate 2 according to the secondmodification is characterized in that the probe chip 25 is mounted inthe wiring substrate 2.

As described in the sixth example embodiment with reference to FIG. 15,the mounting position of the probe chip 25 is preferably disposed closeto the position near the wafer side as much as possible. However, fromthe viewpoint that the mounting area of the back surface of the wiringsubstrate 2 is limited in the probe card 1, the probe chip 25 is notnecessarily disposed near the wafer side.

In the wiring substrate 2, other functional devices and passivecomponents, such as a capacitor, an inductor, and a resistor, may alsobe embedded.

Thus, in the second modification, by embedding the probe chip 25 to bemounted on the wiring substrate 2 in the wiring substrate 2, theprojection formed by mounting the probe chip 25 on the surface of thewafer side of the wiring substrate 2 can be eliminated. Therefore,problems of the thickness of the electrodes 21 a provided on the wiringsubstrate 2 and the thickness of the first anisotropically conductivesheet 6, the second anisotropically conductive sheet, or the like andconcern of in-plane uniformity when performing uniform pressurization tothe wiring substrate 2 when carrying out each of the first to thirdexample embodiments can be made small.

As described above, according to the probe card according to the presentdisclosure and the semiconductor wafer inspection method using the same,when signals are transmitted and received to/from the semiconductorwafer by capacitive coupling or inductive coupling in a non-contactstate, the electromagnetic coupling thereof becomes further larger, andthus signals can be stably transmitted and received. Moreover, since theprobe card according to this disclosure and the semiconductor waferinspection method using the same can be used for, for example, burn-inscreening, quality can be secured, and they are useful for KGD (KnownGood Die) or the like essential for performing high density package,such as SiP (System in Package) or three-dimensional mounting in which aplurality of semiconductor chips are built in one package.

What is claimed is:
 1. A probe card, which is formed on a semiconductorwafer and collectively inspects a plurality of semiconductor chips eachhaving a plurality of pad electrodes, the probe card comprising: a thinfilm substrate having a plurality of projection electrodes on a firstsurface facing the semiconductor wafer and at a position facing each ofthe pad electrodes, a non-contact electrode to be electrically connectedto the pad electrodes by capacitive coupling or inductive coupling, anda plurality of first electrodes provided on a second surface opposite tothe first surface and electrically connected to each of the projectionelectrodes and the non-contact electrode; and a wiring substrate havinga plurality of second electrodes disposed at a side opposite to thesemiconductor wafer in the thin film substrate and at a position facingthe first electrodes, wherein the wiring substrate and the thin filmsubstrate form a first sealed space and the thin film substrate and thesemiconductor wafer form a second sealed space; by reducing the pressurein the first sealed space and the second sealed space, the firstelectrodes and the second electrodes are brought into close contact witheach other and the pad electrodes and the projection electrodes arebrought into close contact with each other; and the pressure of each ofthe first sealed space and second sealed space are independentlyadjusted.
 2. The probe card of claim 1, wherein the pressure of thefirst sealed space is adjusted to be higher than that of the secondsealed space.
 3. The probe card of claim 1, further comprising: ananisotropically conductive sheet that is provided between the wiringsubstrate and the thin film substrate and contains an elastic materialconducting in a mutually pressing direction between the first electrodeand the second electrode.
 4. The probe card of claim 1, furthercomprising: a first anisotropically conductive sheet that is providedbetween the wiring substrate and the thin film substrate and contains anelastic material conducting in a mutually pressing direction of thewiring substrate and the thin film substrate; a pitch conversionsubstrate that is provided between the wiring substrate and the firstanisotropically conductive sheet and has electrodes facing the firstelectrodes on the side facing the thin film substrate and electrodesfacing the second electrodes on the side facing the wiring substrate;and a second anisotropically conductive sheet that is provided betweenthe wiring substrate and the pitch conversion substrate and contains anelastic material conducting in a mutually pressing direction of thewiring substrate and the pitch conversion substrate.
 5. The probe cardof claim 4, wherein the non-contact electrode is an inductor for probingand each semiconductor chip has an inductor for transmission andreception; the pitch conversion substrate has a first inductor formed onthe side of the semiconductor wafer and a second inductor formed on theside of the wiring substrate and electrically connected to the firstinductor; the first inductor is provided at a position facing theinductor for transmission and reception; and the second inductor isprovided at a position facing the inductor for probing.
 6. The probecard of claim 5, wherein the first inductor and the second inductor areconnected in such a manner that the mutual current directions areopposite to each other.
 7. The probe card of claim 5, wherein the firstinductor and the second inductor are disposed in such a manner that thecenter positions are different from each other in the front-backdirection of the pitch conversion substrate.
 8. The probe card of claim5, wherein the pitch conversion substrate contains a magnetic layer atleast in a region facing the inductor for transmission and reception. 9.The probe card of claim 4, wherein the non-contact electrode is aninductor for probing and each semiconductor chip has an inductor fortransmission and reception; the inductor for probing and the inductorfor transmission and reception are opposite to each other; and the pitchconversion substrate has a via containing a magnetic material formed inthe direction of penetrating the pitch conversion substrate between theinductor for transmission and reception and the inductor for probing.10. The probe card of claim 1, wherein the non-contact electrode isformed on the first surface of the thin film substrate; the thin filmsubstrate has, on the second surface, a thin film back surface electrodeto be electrically connected to the non-contact electrode; and the thinfilm back surface electrode is formed at a position apart from thenon-contact electrode by a distance at least 10 times the film thicknessof the thin film substrate.
 11. The probe card of claim 10, wherein thearea of the thin film back surface electrode is smaller than the area ofthe first electrodes connected to the projection electrodes.
 12. Theprobe card of claim 1, wherein the non-contact electrode is formed onthe first surface or the second surface of the thin film substrate andat a position apart from the nearest first electrode of the plurality ofthe first electrodes by a distance at least 10 times the film thicknessof the thin film substrate; and the thin film substrate has, on thesecond surface, a thin film back surface electrode directly to beconnected to the non-contact electrode.
 13. The probe card of claim 12,further comprising: an anisotropically conductive sheet that is providedbetween the wiring substrate and the thin film substrate and contains anelastic material conducting in a mutually pressing direction between thefirst electrodes and the thin film back surface electrode and the secondelectrodes, wherein the contact area with the thin film back surfaceelectrode in the anisotropically conductive sheet is smaller than thecontact area of the first electrodes connected to the projectionelectrodes in the anisotropically conductive sheet.
 14. The probe cardof claim 1, wherein the non-contact electrode is an inductor for probingand each semiconductor chip has an inductor for transmission andreception; the inductor for probing and the inductor for transmissionand reception are opposite to each other; and the thin film substratehas, on the first surface, a bump electrode containing a magneticmaterial formed in such a manner as to penetrate a region where theinductor for probing is formed.
 15. The probe card of claim 1, furthercomprising: a probe chip that is formed in a region facing the thin filmsubstrate in the wiring substrate and communicates with eachsemiconductor chip through the non-contact electrode.
 16. The probe cardof claim 15, wherein the probe chip is disposed in a concave portionformed in a region facing the thin film substrate.
 17. The probe card ofclaim 15, wherein the probe chip is embedded in a region facing the thinfilm substrate.